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In general, mechanical engineering principles derived for continua can be used for MEMS components with the size. larger than 1 nanometer. larger than 1 micrometer. larger than 1 picometer.

The theory of thin plate bending can be used to assess. the deflection only in thin diaphragms of micro pressure sensors. stresses only in thin diaphragms of micro pressure sensors. both the deflection and stresses in thin diaphragms of micro pressure sensors.

Square diaphragms are the. most popular geometry for micro pressure sensors. somewhat popular geometry for micro pressure sensors. least popular geometry for micro pressure sensors.

From a mechanics point of view, the most favored diaphragm geometry in micro pressure sensors is. circular. square. rectangular.

The principal theory used in microaccelerometer design is. plate bending. mechanical vibration. strength of materials.

The natural frequency of a microdevice is determined by its. mass. structure stiffness. mass and structure stiffness.

Microdevices in theory contain. one natural frequency. several natural frequencies. an infinite number of natural frequencies.

The analysis that attempts to determine several or all natural frequencies of a microdevice is called. modal. vibration. model analysis.

“Resonant” vibration of a device made of elastic materials occurs when the frequency of the excitation force. approaches any of the natural frequencies of the device. equals any of the natural frequencies of the device. exceeds any of the natural frequencies of the device.

The dashpot in a mass–spring vibration system serves the purpose of including the. damping effect on the system. acceleration effect on the system. deceleration effect on the system.

The damping effect in most microaccelerometer design is. very important. somewhat important. not important.

The damping effect by compressible fluids. increases with increase of the input frequency of the vibrating mass. decreases with increase of the input frequency of the vibrating mass. remains unchanged with increase of the input frequency of the vibrating mass.

The movement of the beam mass in force-balanced microaccelerometers is usually measured by. piezoresistor. piezoelectric. capacitance changes.

A vibrating beam will have its natural frequency. increased with increase of longitudinal stress in tension. decreased with increase of longitudinal stress in tension. unchanged with increase of longitudinal stress in tension.

Thermal stresses can be induced in mechanically constrained microdevice components by. uniform temperature rise. nonuniform temperature rise. any temperature rise.

Thermal stresses induced in a microdevice component made of dissimilar materials are due to. the difference of coefficients of thermal expansion of the materials. the weakness of the bonding interface. the degradation of materials after bonding.

Thermal stresses are induced in microdevices components free of mechanical constraints by. uniform temperature change. nonuniform temperature change. uniform temperature with time.

The creep deformation in a material becomes serious. at any temperature. above half the melting point. above half the homologous melting point.

The homologous melting point of a material is defined as the melting point on the scale of. absolute temperature. Celsius temperature. Fahrenheit temperature.

The parts of microsystems that are obviously vulnerable to creep failure are. solder bonds. epoxy resin bonds. silicone rubber bonds.

There are generally. two modes of fracture at the interfaces of microdevices. three modes of fracture at the interfaces of microdevices. four modes of fracture at the interfaces of microdevices.

The most frequently occurring fracture failure mode in microstructures is. Mode III. Mode II. Mode I.

Interfaces in microdevices are vulnerable to. mixed Mode I and II. mixed Mode I and III. mixed Mode II and III failure.

Fracture mechanics analysis of interfaces in microstructures requires the distribution of. normal stresses at the vicinity of the interface. shear stresses at the vicinity of the interface. both the normal and shear stresses at the vicinity of the interface.

The finite element method is a viable analytical tool for microstructures of. simple geometry. complex geometry and loading/boundary conditions. complex loading and boundary conditions.

The very first step in a finite element analysis is. to find the approximate solution. to set the governing equation and boundary condition. to subdivide the continuum into a number of subdivisions, a process called discretization.

The primary unknown quantity in a finite element analysis is the quantity that. appears in the formulation. the most important quantity. the most desirable quantity to be determined.

The primary unknown quantity in a stress analysis by the finite element method is. stress. strain. displacement.

The constitutive relation in a finite element analysis relates. the construction of appropriate formulations. the primary and other essential quantities. the loading and boundary conditions.

The von Mises stress represents. the stress component following the von Mises principle. the stress for a specific material. stresses in a structure of complex geometry.